| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing pad effective for especially maintaining a proper value of a polishing rate and improving in-plane uniformity after polishing in an object to be polished, and extremely effective for producing chemical mechanical polishing, etc. of a semiconductor wafer, etc., and to provide a method of manufacturing the same. <P>SOLUTION: In this polishing pad having a groove 1 within a polishing surface and formed by foamed polyurethane, a machining surface of the groove 1 constituted of side surface 11 and bottom surface 12 of the groove 1 has surface roughness (Ra)≤10. Its manufacturing method includes a process for forming a groove having a rectangular concentric cross-sectional shape on the polishing surface by stepwisely changing feed speed and feed amount of groove machining blade. <P>COPYRIGHT: (C)2007,JPO&INPIT |
