| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive laminate which has a conductive layer exhibiting a sufficient adhesion strength formed on an insulating substrate having a smooth surface; and to provide a method for manufacturing the conductive laminate.SOLUTION: In a conductive laminate, an insulating substrate (A), a resin layer (B), a metal particle layer (C) and a conductive layer (D) are constituted in this order. The resin layer (B) is a resin layer obtained by drying or curing a resin composition (B-1) containing a polyimide resin (b1) and an epoxy resin (b2). The metal particle layer (C) is a metal particle layer containing one or more metal particles (c2) selected from the group consisting of gold, silver, copper and platinum protected by a compound (c1) having a nitrogen atom, a sulfur atom, a phosphorus atom or an oxygen atom. The conductive layer (D) is formed by a plating method.SELECTED DRAWING: None |
