| 摘要 |
PROBLEM TO BE SOLVED: To provide a forming method of a multistage bump which can easily and surely form a multistage bump having little dispersion of height and form, without complicating an equipment and increasing the cost. SOLUTION: The tip of a metal wire 3 which protrudes from the tip of a capillary 2 is fused and turned into a ball type. The formed ball B1 is compression-bonded to a pad 8 for forming a bump on a substrate 7, and molded in a nail head type. The metal wire 3 is cut out in a specified length. The cathode 6 of a melting means is brought into contact with a cathode pad 9 protrusively formed on the pad 8 for forming a bump, and the anode 5 of the melting means is arranged in the vicinity of the cut-out part. By applying a current in this state, the cut-out part is melted and formed in a ball type. Thereby a multistage bump can be easily and surely formed. |
