SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To enable a semiconductor device to be easily adjusted and enhanced in reliability after it is assembled. SOLUTION: A polyimide film 17 is partially provided as a dielectric film onto a microstrip line 7 and an open stub 8 in an input impedance-matching circuit 5 and an output impedance-matching circuit 6 both formed on a dielectric board 16. The polyimide film 17 is formed through such a manner that a proper amount of liquid polyimide is dropped down and cured at a temperature of 300 deg.C or so.