发明名称 MULTISTAGE CONNECTING ELECTRONIC COMPONENT MODULE
摘要 PROBLEM TO BE SOLVED: To provide a multistage connecting electronic component module wherein electronic components can be easily increased or separated. SOLUTION: A module is provided with a module main body 21 which incorporates an electronic component, a recess 33 is provided on one side of the module main body 21 and a protruding part 23 on the other side, a spiral groove 33a is formed on either the recess 33 or the protruding part 23, and a protruding part 31 having a shape that can be screwed into the spiral groove 33a is provided on the other part.
申请公布号 JPH10144864(A) 申请公布日期 1998.05.29
申请号 JP19960298988 申请日期 1996.11.11
申请人 NEC CORP 发明人 TAMURA TETSUYA
分类号 H01L25/18;G11B33/12;H01L25/10;H01L25/11;H05K5/00;(IPC1-7):H01L25/10 主分类号 H01L25/18
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