发明名称 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
摘要 After a substrate is cleaned, a liquid layer of a rinse liquid is formed so as to cover one surface of the substrate. Then, a liquid supply nozzle moves outward from above the center of the substrate. The liquid supply nozzle is stopped once at the time point where it moves by a predetermined distance from above the center of the substrate. In this time period, the liquid layer is divided within a thin layer region by a centrifugal force, so that a drying core is formed at the center of the liquid layer. Thereafter, the liquid supply nozzle moves outward again, so that a drying region where no rinse liquid exists expands on the substrate with the drying core as its starting point.
申请公布号 US2009074402(A1) 申请公布日期 2009.03.19
申请号 US20080209039 申请日期 2008.09.11
申请人 SOKUDO CO., LTD. 发明人 MIYAGI TADASHI;KANAOKA MASASHI;SHIGEMORI KAZUHITO;YASUDA SHUICHI;SANADA MASAKAZU
分类号 G03D5/00 主分类号 G03D5/00
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