发明名称 STRUCTURES AND METHODS FOR INTERCONNECTS AND ASSOCIATED ALIGNMENT AND ASSEMBLY MECHANISMS FOR AND BETWEEN CHIPS, COMPONENTS, AND 3D SYSTEMS
摘要 Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems.
申请公布号 US2016294035(A1) 申请公布日期 2016.10.06
申请号 US201615074083 申请日期 2016.03.18
申请人 Nuvotronics, INC 发明人 Rollin Jean-Marc;Reid J. Robert;Sherrer David;Stacy Will;Vanhille Ken;Oliver J. Marcus;Smith Tim
分类号 H01P11/00;H01P5/02;H01P3/06 主分类号 H01P11/00
代理机构 代理人
主权项 1. A three-dimensional microstructure, comprising: a first microstructural coaxial waveguide element comprising one or more layers of material, the waveguide comprising an outer conductor, a center conductor disposed within the outer conductor, and a detent mounted to the outer conductor which extends beyond an end of the outer conductor, wherein one or more of the outer conductor, center conductor, and detent comprises a plurality of the layers of material; and a second microstructural coaxial waveguide element comprising one or more layers of material, the second microstructural coaxial waveguide element comprising an outer conductor, a center conductor and a clip mounted to the outer conductor of the second microstructural coaxial waveguide element, the clip configured to receive the detent, the detent and clip positioned relative to one another electrically and mechanically couple the respective center conductors of the first and second microstructural coaxial waveguide elements and configured to electrically and mechanically couple the respective outer conductors of the first and second microstructural coaxial waveguide elements wherein one or more of the outer conductor, center conductor, and clip of the second microstructural coaxial waveguide element comprises a plurality of the layers of material.
地址 Radford VA US
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