| 摘要 |
PROBLEM TO BE SOLVED: To provide an art of inhibiting curvature thermal deformation of a heat transfer member of a semiconductor module.SOLUTION: A semiconductor module 10 comprises a heat transfer member 22 which includes an intermediate layer 70, a first graphite layer 71 and a second graphite layer 72. The first graphite layer 71 lies adjacent to a surface of the intermediate layer 70 on a semiconductor chip 20 side and composed of a plurality of laminated oriented graphite sheets. The second graphite layer 72 lies adjacent to a surface of the intermediate layer 70 on a cooler 62 side and composed of a plurality of laminated oriented graphite sheets. The plurality of oriented graphite sheets are arranged in such a manner that a lamination direction of the plurality of oriented graphite sheets which compose the first graphite layer 71 and a lamination direction of the plurality of oriented graphite sheets which compose the second graphite layer 72 are parallel with each other.SELECTED DRAWING: Figure 2 |
