INDUCTOR ASSEMBLY AND METHOD OF USING SAME

摘要

An inductor assembly generally comprises at least one helical inductive component comprising that includes a plurality of conductive line layers having conductive lines therein. A plurality of vias are configured to couple conductive lines from two or more conductive line layers such that a spacing between two adjacent parallel conductive lines, in different conductive line layers from each other, is two or more times a distance between respective bottom surfaces of two adjacent conductive line layers.

主权项

1. An integrated circuit comprising:
a semiconductor substrate ; at least one helical inductive component including a plurality of dielectric layers above the semiconductor substrate, the plurality of dielectric layers containing therein: a plurality of conductive line layers having conductive lines , wherein each of the plurality of conductive line layers comprises a pair of conductive lines parallel to each other and perpendicular to a pair of conductive lines in a next adjacent conductive line layer; and a plurality of vias configured to couple said conductive lines of adjacent layers from two or more of said plurality of conductive line layers such that a smallest spacing between two adjacent parallel conductive lines aligned one above the other, in different conductive line layers from each other, is two or more times a distance between respective bottom surfaces of two adjacent conductive line layers of said plurality of conductive line layers.