METAL FILM BONDED BODY, BONDING AGENT LAYER AND BONDING AGENT

摘要

Techniques capable of stably providing a metal film bonded body which is to be bonded with a film of various kinds of metals and used for a printed wiring board and other industrial parts, and which has an excellent peeling strength even when it is used for higher-density high pattern accuracy wiring. The techniques provide a bonding agent, a bonding agent layer and a metal film bonded body, by using as a bonding agent-forming heat resisting resin matrix an uncured thermosetting resin containing a resin in which a photosensitive group substitutes for a part of a functional group and/or a mixed resin of an uncured photosensitive resin and a thermoplastic resin; and using as a heat resisting resin matrix for a bonding agent layer a homogeneous resin complex having a pseudo-uniform compatible structure, a eutectic continuous structure or a spherical domain structure which are formed by curing the mentioned resin and/or mixed resin.