发明名称 Suspension board with circuit and producing method thereof
摘要 A suspension board with circuit includes a metal supporting board having a support opening portion, a base insulating layer disposed at one side of the metal supporting board, and a conductive layer disposed at one side of the base insulating layer and including a plurality of terminal portions overlapped with the support opening portion and disposed at spaced intervals to each other. The base insulating layer includes a plurality of base opening portions that are disposed between the plurality of terminal portions in an arrangement direction, a plurality of thick portions that are overlapped with each of end portions of the plurality of terminal portions in a direction orthogonal to both directions of the thickness direction and the arrangement direction, and a plurality of thin portions that are disposed along edge portions of the plurality of base opening portions between the plurality of thick portions and are thinner than the plurality of thick portions.
申请公布号 US9521745(B2) 申请公布日期 2016.12.13
申请号 US201615054391 申请日期 2016.02.26
申请人 NITTO DENKO CORPORATION 发明人 Fujimura Yoshito;Kanezaki Saori;Terada Naohiro
分类号 G11B5/48;H05K1/02;H05K1/11;H05K3/00;H05K3/10;H05K3/40;H05K3/46;H05K1/05 主分类号 G11B5/48
代理机构 Edwards Neils LLC 代理人 Edwards, Esq. Jean C.;Edwards Neils LLC
主权项 1. A suspension board with circuit comprising: a metal supporting board having a support opening portion passing through in a thickness direction, a base in layer disposed at one side in the thickness direction of the metal supporting board, and a conductive layer disposed at one side in the thickness direction of the base insulating layer and including a plurality of terminal portions, when projected in the thickness direction, overlapped with the support opening portion and disposed at spaced intervals to each other, wherein the base insulating layer includes a plurality of base opening portions that pass through in the thickness direction and are when projected in the thickness direction, disposed between the plurality of terminal portions in an arrangement direction of the plurality of terminal portions, a plurality of thick portions that are, when projected in the thickness direction, overlapped with each of end portions of the plurality of terminal portions in a direction orthogonal to both directions of the thickness direction and the arrangement direction, and a plurality of thin portions that are disposed along edge portions of the plurality of base opening portions between the plurality of thick portions and are thinner than the plurality of thick portions.
地址 Osaka JP