| 摘要 |
The apparatus includes a vacuum chamber capable of accommodating a to-be-processed substrate, which is at least one of the front substrate and the back substrate, an evacuation mechanism which evacuates an inside of the vacuum chamber, a processing electrode which is disposed to be opposed to the to-be-processed substrate within the vacuum chamber, an electrical-conductivity-imparting process mechanism which imparts electrical conductivity to the to-be-processed substrate, and an electric field application mechanism which applies an electric field between the to-be-processed substrate, to which the electrical conductivity is imparted by the electrical-conductivity-imparting process mechanism, and the processing electrode.
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