| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component packaging structure which is capable of packaging an electronic component by embedding it in an insulating layer with reliability. <P>SOLUTION: The above manufacturing method comprises processes of forming a viscous liquid resin 14a on a mounted body 10, arranging and temporarily bonding an electronic component 20 onto the viscous liquid resin 14a, of obtaining a first insulating layer 14, by making the viscous liquid resin 14a harden through thermal treatment, to fix the electronic component 20 to the first insulating layer 14, and of forming a second insulating layer 16 that covers the electronic component 20. <P>COPYRIGHT: (C)2007,JPO&INPIT |
