| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayered wiring board of a structure, wherein the adhesive strength of conductor wiring layers to hole conductors is high, the contact resistance between the conductor wiring layers and the via hole conductors is also low and a high-density wiring is possible, and a simple method of manufacturing the multilayered wiring board. SOLUTION: A multilayered wiring board is constituted into a structure, wherein via hole conductors 4, which are formed by filling metallic powder 5 in the interior of an insulating board formed by laminating a plurality of insulating layers 2 containing at least an organic resin, and conductor wiring layers 3 which are connected with the conductors 4 and consist of a metal foil are formed in the interior of the insulating board, and in the connection parts of the layers 3 with the conductors 4, the layers 3 are embedded in the conductors 4 with a line width narrower than the hole diameter of the conductors 4. Moreover, neck parts 6 are formed in the contact parts of the layers 3 with the metallic powder 5 in the conductors 4. |
