EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To obtain the subject composition needing no pretreatment when used for impressing ink marks and excellent in the abilities of not fouling mold and impressing the ink marks by including an epoxy resin composition, a mold release agent of fatty acid, and an amino-modified silicone. SOLUTION: This epoxy resin composition is obtained by including, in (A) an epoxy resin composition comprising an epoxy resin (e.g. cresol novolak type epoxy resin or bisphenol A type epoxy resin) of pref. 5 to 35 wt.% and a setting agent (e.g. phenol novolak resin or cresol novolak resin) in the equivalent ratio of 0.1 to 10 based on the epoxy resin, (B) 0.01 to 0.1 wt.% of a fatty acid-based mold release agent shown by formula I (R is a 14-18C alkyl) based on the whole of the epoxy resin composition and (C) 0.01 to 1 wt.% of an amino- modified silicone shown by formula II (an amino equivalent is 200 to 10,000).