| 摘要 |
PURPOSE:To obtain copper-clad epoxy resin laminate having excellent moisture resistance, solder heat resistance, warpage characteristic and punching workability by employing bisphenols and tertiary amine is bisphenol epoxy resin. CONSTITUTION:A paper cloth base material is coated and impregnated with a resin composition which contains an indispensable ingredients bisphenol epoxy resin, bisphenols represented by a formula, tertiary amine to form a prepreg. The material is coated and impregnated with the composition, and dried. Then, prepregs made of glass base materials are superposed on front and rear faces of the prepreg using a plurality of the paper base materials, heated, press- laminated and integrated. Thus, a copper-clad epoxy resin laminate having good moisture resistance, solder heat resistance, warpage characteristic and punching workability can be obtained.
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