发明名称 電子部品の圧着装置及び電子部品の圧着方法
摘要 PROBLEM TO BE SOLVED: To provide an electronic component press-fitting device abd method in which, even if an angle dislocation of an electronic component is equal to or more than a limit angle of a press-fitting tool, the angle dislocation can be corrected by the press-fitting tool.SOLUTION: In the case where angle dislocation dΘ of an electronic component 3 placed on an intermediate stage exceeds a limit angle of a press-fitting tool 21, a control section rotates the press-fitting tool by Tr1 in a direction where the angle dislocation occurs in the electronic component 3, within a range of the limit angle. The control section next rotates the press-fitting tool 21 just at the angle dΘ reversely to a direction in which the press-fitting tool 21 is rotated prior to pickup. Thus, the electronic component 3 is recognized by a recognition camera in the state where the angle dislocation of the electronic component 3 held by the press-fitting tool 21 is corrected to 0°.
申请公布号 JP5974302(B2) 申请公布日期 2016.08.23
申请号 JP20130026293 申请日期 2013.02.14
申请人 パナソニックIPマネジメント株式会社 发明人 辻澤 孝文
分类号 H05K13/04;H01L21/603;H05K13/08 主分类号 H05K13/04
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