| 摘要 |
A contact structure for electroconductively connecting between an electronic part and a board includes a contact member, which is provided between the electronic part and the board, having a leg portion for electroconductively connecting between the electronic part and the board. The leg portion of the contact member can be bent and deformed in a simple and reliable manner by utilizing internal stress even if the contact member is formed very fine corresponding to forming the electronic part very fine, and thus, the leg portion of the contact member can appropriately serve as an elastic contact member The contact member can absorb distortion due to thermal expansion coefficient differences between the electronic part and the board, thereby ensuring electroconductive connection between the electronic part and the board.
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