| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce a deformation of a board due to heat when mounting a semiconductor device onto a circuit board for double-sided mounting by reflow processing. <P>SOLUTION: A first semiconductor device and a second semiconductor device respectively having a rectangular bottom face are used for a double-sided circuit board and mounted to the double-sided circuit board so as to be orthogonal to each other in a crisscross shape. By this constitution, it is possible to reduce the deformation of the circuit board, and further, it is possible to achieve the effect of the deformation reduction even when arranged in a T-shape or an L-shape. When a plurality of the first semiconductor devices are mounted on one face, that is, a first mounting face of the circuit board, it is possible to reduce the deformation of the circuit board by mounting each second semiconductor device on a second mounting face, so as to be overlapped with a partial region of at least two first semiconductor devices in a plurality of the first semiconductor devices and a boundary part between the two first semiconductor devices. <P>COPYRIGHT: (C)2007,JPO&INPIT |
