发明名称 部品内蔵多層基板
摘要 A multilayer substrate comprises: a stack having a plurality of insulating base materials; a first component arranged within the stack at a first level in a thickness direction of the stack; a second component arranged within the stack at a second level different from the first level and arranged so that, in a plan view, at least a portion of the second component overlaps with a portion of the first component; and a supplementary member arranged to at least partly exist in a range, in a thickness direction, as high as or higher than a lower end of the second component and as high as or lower than an upper end of the second component, and in a plan view, within a region of a projected area of the first component not overlapped with the second component, the supplementary member having a rigidness higher than the insulating base materials.
申请公布号 JP5967335(B2) 申请公布日期 2016.08.10
申请号 JP20160512661 申请日期 2015.03.26
申请人 株式会社村田製作所 发明人 大坪 喜人
分类号 H05K3/46 主分类号 H05K3/46
代理机构 代理人
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