| 摘要 |
<P>PROBLEM TO BE SOLVED: To easily and correctly estimate breakage of a chip due to impact force in bonding after stacking chips, when a fragile porous low-k material which has less bondability and is easily peeled is used as an insulating film and in a thin chip having a chip thickness of 100 μm or less. <P>SOLUTION: In an apparatus capable of estimating stack resistance by stacking to bond a chip B (upper chip) onto a chip A (lower chip); an element for evaluating the resistance is provided on the chip A, and the chip positions correspond to corners in a stacking range within a stacking range of the chips A and B and in a region inside of 50-1,000 μm from the outermost peripheral edge of the stacking range. <P>COPYRIGHT: (C)2007,JPO&INPIT |
