| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for reducing a thickness and for improving electronic properties of a semiconductor device in which two semiconductor chips are laminated, which are sealed with one resin seal. SOLUTION: The semiconductor device includes: a resin seal; two semiconductor chips which are positioned within the resin seal, and on which front face of their front and rear faces external terminals are formed; and a lead extending over the inner side and outer side of the resin seal, wherein the lead is branched into two leads at least inside the resin seal, one of the branched leads is fixed to the front face of one of the semiconductor chips and electrically connected to the external terminal of the front face, the other of the branched leads is fixed to the front face of the other of the semiconductor chips and electrically connected to the external terminal of the front face, wherein each of the two semiconductor chips is laminated with their rear faces facing each other. COPYRIGHT: (C)2005,JPO&NCIPI
|
