发明名称 Indoor equipment of air-conditioner
摘要 An indoor equipment of an air-conditioner, the indoor equipment comprising: a casing including an inlet and an outlet, the casing including therein, a heat exchanger, an indoor fan which sends indoor air sucked from the inlet to the outlet through the heat exchanger, an indoor fan motor which drives the indoor fan, the indoor fan motor including a rotor of the motor and a stator having an electric winding, and an electric component box which accommodates a circuit board controlling the indoor fan motor, wherein an inverter circuit controlling a current flowing through the stator is mounted on the circuit board which is accommodated in the electric component box, and wherein at least one element among switching elements and diode elements which configure the inverter circuit is formed of wide bandgap semiconductor.
申请公布号 US9383114(B2) 申请公布日期 2016.07.05
申请号 US201213433784 申请日期 2012.03.29
申请人 MITSUBISHI ELECTRIC CORPORATION 发明人 Takahara Hideki;Matsumoto Takashi
分类号 F24F7/007;F24F1/00;F24F11/00;F24F13/20 主分类号 F24F7/007
代理机构 Buchanan Ingersoll & Rooney PC 代理人 Buchanan Ingersoll & Rooney PC
主权项 1. An indoor equipment of an air-conditioner, the indoor equipment comprising: a casing including an inlet and an outlet, the casing including therein, a heat exchanger,an indoor fan which sends indoor air sucked from the inlet to the outlet through the heat exchanger,an indoor fan motor which drives the indoor fan, the indoor fan motor including a rotor of the motor and a stator having an electric winding, andan enclosed electric component box made of a high flame-resistant material which accommodates a circuit board controlling the indoor fan motor, the outer surface of the electric component box having an opening, a connector with high flame resistance is located in the opening, wherein an inverter circuit controlling a current flowing through the stator is mounted on the circuit board which is accommodated in the electric component box, wherein at least one element among switching elements and diode elements which configure the inverter circuit is formed of a wide bandgap semiconductor, and wherein the circuit board is arranged so that a surface of a module of the inverter circuit directly contacts a housing of the electric component box for heat dissipation without fins on the module.
地址 Chiyoda-Ku, Tokyo JP