| 摘要 |
PROBLEM TO BE SOLVED: To improve wiring efficiency of a buildup multilayer printed wiring board. SOLUTION: Copper bumps 4a, 4b, 5a, 5b which are thicker than circuit patterns 2a, 2b are formed on a copper clad laminated board 1. Anisotropic conducting sheets 6a, 6b covering the circuit patterns 2a, 2b and the copper bumps 4a, 4b, 5a, 5b are laminated on the front and the back surfaces of the copper clad laminated board 1 under heating and pressurizing conditions. |
