LIGHT EMITTING DEVICE HAVING VERTICAL STRUCTURE AND PACKAGE THEREOF

摘要

A light emitting device having a vertical structure and a package thereof, which are capable of damping impact generated in a substrate separation process, and achieving an improvement in mass productivity. The device and package include a sub-mount, a first-type electrode, a second-type electrode, a light emitting device, a zener diode, and a lens on the sub-mount.

主权项

1. A light emitting device package comprising:
a sub-mount having a first surface and a second surface; a first metal layer on the first surface of the sub-mount; a second metal layer on the second surface of the sub-mount; and a light emitting device on the first surface comprising:
a supporting layer including an anti-diffusion layer;a first electrode on the supporting layer;a semiconductor light emitting structure electrically connected to the first electrode; anda second electrode electrically connected to the semiconductor light emitting structure,wherein the first electrode is electrically connected to the first metal layer and the second electrode is electrically connected to the second metal layer,wherein the semiconductor light emitting structure comprises a light extraction structure, wherein one of the first metal layer and the second metal layer directly contacts the sub-mount, wherein the sub-mount has a cavity, the cavity having a bottom portion and an inclined portion, and wherein the first metal layer has an inclined surface, and the inclined surface of the first metal layer is on the inclined portion of the cavity.