发明名称 |
PROCESS FOR PREPARATION OF SILICON ON INSULATOR SUBSTRATES WITH IMPROVED RESISTANCE TO FORMATION OF METAL PRECIPITATES |
摘要 |
A process for inhibiting the formation of metal-precipitate defects in an SOI wafer is disclosed. The process includes heating the wafer for a time sufficient to reduce metal concentration in the monocrystalline film through diffusion into the bulk of the wafer. The insulator structure is made permeable via holes, channels, or streets spaced at a predetermined distance (L) apart to allow the diffusion of metals to occur.
|
申请公布号 |
WO0010195(A2) |
申请公布日期 |
2000.02.24 |
申请号 |
WO1999US18085 |
申请日期 |
1999.08.10 |
申请人 |
MEMC ELECTRONIC MATERIALS, INC. |
发明人 |
FALSTER, ROBERT, J.;CRAVEN, ROBERT, A. |
分类号 |
H01L21/762;(IPC1-7):H01L/ |
主分类号 |
H01L21/762 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|