发明名称 AUDIO EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To reduce the influence of noise generated between a pair of devices sharing commercial power source. SOLUTION: In the configuration in which a signal ground SG being a path of a level to be the reference of a signal circuit 123 is connected to the first chassis ground CE 11 through the first connection line L11, when a position P112 at which the first connection line L11 is connected to the signal ground SG is defined as a reference connection position, and a connection conductor 125 which is connected through the second connection line L12 and where a ground terminal to which a conductor can be connected from the outside the housing is connected is provided at the neighborhood position of the reference connection position P112 in the signal ground SG, an optional position on the first connection line L11 or the second chassis ground CE12 provided in the vicinity of the first ground CE11.
申请公布号 JP2001326536(A) 申请公布日期 2001.11.22
申请号 JP20000146253 申请日期 2000.05.18
申请人 YOSHII HIDEKAZU 发明人 YOSHII HIDEKAZU
分类号 H03F1/00;H03F3/181;(IPC1-7):H03F1/00 主分类号 H03F1/00
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