| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroplating method where, in the case electroplating is performed in a foam layer of a plating liquid including a surfactant, the stable foam layer of the plating liquid is secured, and the generation of pin holes and pits in a plating film is suppressed. SOLUTION: Plating liquid foam composed of the foam with a <0.5 mm diameter of a plating liquid including surfactant, and prepared in such a manner that the volume decrease rate for 10 sec is controlled to≤50% is in contact with an anode and a cathode as the member to be plated, and, while continuously feeding the plating liquid foam to the surface of the member to be plated, voltage is applied to the space between the cathode and the anode, so as to form a plating film on the surface of the member to be plated. COPYRIGHT: (C)2009,JPO&INPIT
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