Integrated circuit interposer and method of manufacturing the same

摘要

Systems and methods are provided for an interposer for coupling two or more integrated circuit dies to a circuit package. A first integrated circuit portion is disposed on a first location of a single semiconductor substrate. A second integrated circuit portion is disposed on a second location of the single semiconductor substrate, where the second integrated circuit portion is electrically isolated from the first integrated circuit portion along a first axis. The first and second integrated circuit portions are configured to provide an electrical coupling to two or more corresponding top die integrated circuits across a second axis that is perpendicular to the first axis.

主权项

1. A method of fabricating an interposer for coupling two or more integrated circuit dies to an integrated circuit package, the method comprising;
printing a first portion of the interposer at a position of a first reticle on an integrated circuit wafer substrate; printing a second portion of the interposer at a position of a second reticle on the integrated circuit wafer substrate, the position of the second reticle being adjacent the position of the first reticle; providing an isolation axis between the first portion of the interposer and the second portion of the interposer on the integrated circuit wafer substrate, the isolation axis electrically isolating the first portion of the interposer from the second portion of the interposer; and cutting the integrated circuit wafer substrate without cutting along the isolation axis to form an interposer that includes both the first portion of the interposer and the second portion of the interposer; wherein the first portion of the interposer and the second portion of the interposer are fabricated using a reticle mask such that a combined size of the first portion of the interposer and the second portion of the interposer is larger a than reticle size of the reticle mask.