| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition which enables homogeneous mixing of filler in an adhesive layer, which, even when a process for collectively curing adhesive layers is employed when producing a multistage package, enables wire bonding to be performed stably before curing and exhibits excellent adhesive strength after curing and, especially, which can attain high package reliability in a semiconductor device, and to provide an adhesive sheet having an adhesive layer comprising the adhesive composition and a method for producing a semiconductor device using the adhesive sheet.SOLUTION: An adhesive composition comprises: an acrylic polymer (A); a thermosetting resin (B) having a reactive double bond group; and filler (C) having a reactive double bond group on the surface. The filler (C) has an average particle diameter of 0.01 to 0.2 μm, the thermosetting resin (B) comprises an epoxy resin and a thermosetting agent, and either or both of the epoxy resin and the thermosetting agent have a reactive double bond group. |
