| 摘要 |
<p>A ceramic substrate, a manufacturing method thereof, and a light emitting diode package are provided to improve productivity by forming a via pattern in two unit modules at the same time. A ceramic substrate(100) includes a ceramic plate(110), a plurality of bonding pads(120), a plurality of soldering pads and a plurality of via patterns(140). Bonding pads are formed on the single-side of the ceramic plate. Bonding pads are used as an electrode. An LED(Light Emitting Diode) chip(200) is mounted on the bonding pads. The LED chip includes a red chip(200a), a green chip(200b) and a blue chip(200c). Soldering pads are formed in other surface of the ceramic plate. Via patterns electrically connect the bonding pads and the soldering pads by penetrating through the ceramic plate. The via patterns are formed in the one side end of the ceramic plate.</p> |
