发明名称 |
Frame sealant and sealing method, display panel and display device sealed therewith |
摘要 |
A frame sealant and a sealing method, a display panel and a display device containing the frame sealant. A sealing method for a frame sealant comprises: successively coating a water-borne epoxy resin and a solvent-based epoxy resin or successively coating a solvent-based epoxy resin and a water-borne epoxy resin on a first substrate, aligning and pressing the first substrate and a second substrate; or coating a water-borne epoxy resin on a first substrate, coating a solvent-based epoxy resin on a second substrate, and aligning and pressing the two substrates; a first material by which a nano-scale second material is encapsulated is dispersed in the solvent-based epoxy resin, wherein, the first material is a hydrophilic polymeric material and the second material is one which will undergo an exothermic reaction with water. When the frame sealant is pressed, the hydrophilic polymeric material will absorb water and thus be saturated with water, the remaining water will react with the material which undergoes an exothermal reaction with water to generate heat, which will cause the curing of the frame sealant as an internal heat source. |
申请公布号 |
US9454042(B2) |
申请公布日期 |
2016.09.27 |
申请号 |
US201314375510 |
申请日期 |
2013.11.14 |
申请人 |
BOE Technology Group Co., Ltd. |
发明人 |
Wang Xinxing;You Jaegeon;Yao Jikai |
分类号 |
C09J163/00;G02F1/1339;C09J5/04;B32B7/12;B32B37/10;B32B37/12;B32B37/18;C09D163/00 |
主分类号 |
C09J163/00 |
代理机构 |
Collard & Roe, P.C. |
代理人 |
Collard & Roe, P.C. |
主权项 |
1. A sealing method for a frame sealant, comprising:
successively coating a water-borne epoxy resin and a solvent-based epoxy resin on a first substrate, aligning and pressing the first substrate and a second substrate; or successively coating the solvent-based epoxy resin and the water-borne epoxy resin on a first substrate, aligning and pressing the first substrate and a second substrate; or coating the water-borne epoxy resin on a first substrate, coating the solvent-based epoxy resin on a second substrate, and aligning and pressing the two substrates; a first material by which a nano-scale second material is encapsulated is dispersed in the solvent-based epoxy resin, wherein, the first material is a hydrophilic polymeric material and the second material is one which will undergo an exothermic reaction with water. |
地址 |
Beijing CN |