发明名称 Fabrication apparatus for fabricating a patterned layer
摘要 The invention relates to a fabrication apparatus for fabricating a patterned layer (18) on a substrate (14). Protective material (17) is applied in second regions on the substrate (14) and liquid layer material (18) is then printed in first regions being different to the second regions on the substrate (14). The layer material (18) is dried by heating the layer material (18) to a drying temperature being smaller than a melting temperature of the protective material (17), before removing the protective material (17) from the substrate (14) by using a removing temperature being larger than the melting temperature of the protective material (17). A patterned layer (18) can therefore be produced, without using, for example, a costly photolithography process, and because of the use of the protective material (17) the layer material (18) is present in the desired first regions only and not in the second regions. This improves the quality of the patterned layer, which may be used for producing an OLED.
申请公布号 US9472787(B2) 申请公布日期 2016.10.18
申请号 US201214117436 申请日期 2012.05.09
申请人 OLEDWorks GmbH 发明人 Rickers Christoph;Kruijt Pieter Gijsbertus Maria
分类号 H01L21/02;H01L51/56;H01L51/00;H01L51/50 主分类号 H01L21/02
代理机构 代理人 Singer Stephen P.
主权项 1. A fabrication method for fabricating a patterned layer on a substrate that is coated with a conductive layer, wherein the substrate comprises first regions, in which layer material forming the layer is to be applied, and second regions, in which the layer material is not to be applied, the fabrication method comprising: applying protective material in the second regions on the substrate, printing liquid layer material in the first regions on the substrate, drying the layer material by heating the layer material to a drying temperature being smaller than a melting temperature of the protective material , ablating the conductive layer through at least one of the protective material and the applied layer material for generating a patterned conductive layer, and removing the protective material from the substrate by using a removing temperature being larger than the melting temperature of the protective material.
地址 Aachen DE