发明名称 Printed circuit board, method of manufacturing the printed circuit board, memory module having the printed circuit board and method of manufacturing the memory module
摘要 A PCB can include an insulating member, a cooling member, and a circuit pattern. The cooling member can be built into the insulating member. The cooling member can have a cooling passageway through which a cooling fluid can flow. The circuit pattern can be formed on the insulating member. Thus, high heat in the circuit pattern can be rapidly dissipated by the cooling fluid flowing through the cooling passageway.
申请公布号 US2009056979(A1) 申请公布日期 2009.03.05
申请号 US20080231196 申请日期 2008.08.29
申请人 SAMSUNG ELECTRONICS CO., LTD 发明人 HAN SEONG-CHAN;LEE DONG-CHUN;LEE YOUNG-SOO
分类号 H05K1/00;H05K3/00 主分类号 H05K1/00
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