MANUFACTURE OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device capable of reducing the size of a wafer by eliminating effusion of adhesive and the like. SOLUTION: A wafer 10 to be divided into a plurality of chips 14 is prepared and a tape 30 with an adhesive layer 33 formed on its tape base material 31 is prepared. The adhesive layer of the tape is bonded to the reverse side of the wafer. The wafer is cut from its surface through the adhesive layer of the tape to be divided into a plurality of chips. The divided chips 14 with the adhesive layer are detached and used for die bonding with the adhesive layer.