| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive composition which requires no burning, makes it possible to obtain necessary and sufficient adhesion when it is applied under a humidity of 2-60%, can be developed at a low alkali intensity, makes it possible to carry out development with keeping high sensitivity while forming no residue, ensures sharp edges, can provide a very hard resist film, and is improved in scratch resistance in the handling before development. <P>SOLUTION: The positive photosensitive composition comprises, as essential components, (A) a high molecular substance having at least one carboxyl group in a molecule, (B) a photo-thermal conversion material that absorbs infrared rays from an image exposure light source to convert them into heat, and a specific resin. <P>COPYRIGHT: (C)2008,JPO&INPIT |
