Sealed feedthrough for a thickfilm ceramic substrate and method of making the same.

摘要

A sealed via hole for a ceramic substrate (11) of a thick-film circuit having a through opening (14) whose inner lateral surface (15) is provided with a conducting layer (16) which is connected to conducting tracks on the two surfaces (12, 13) of the ceramic substrate (11) and one opening of which is closed off (sealed) using an inorganic layer (17, 18), the sealing inorganic layer consisting at least of one carrier layer (17) which adjoins the conducting layer (16) and overlaps with the ceramic substrate and a sealing layer (18), and a method for the production thereof.