ETCHING APPARATUS AND METHOD

摘要

PROBLEM TO BE SOLVED: To provide an etching apparatus capable of enhancing yield of a product by uniformly etching an object and to provide an etching method of the object utilizing the apparatus. SOLUTION: In the etching apparatus, pressure exerted on the object is minimized during an etching process for thinning the thickness of the object, and the etching solution is applied to entire surface of the object under uniform pressure. Since the breakage of the object is prevented and the object can be uniformly etched during the etching process, the thickness of the object may be minimized. COPYRIGHT: (C)2008,JPO&INPIT