发明名称 |
Power quad flat no-lead (PQFN) semiconductor package with leadframe islands for multi-phase power inverter |
摘要 |
According to an exemplary implementation, a power quad flat no-lead (PQFN) package includes a U-phase output node situated on a first leadframe island of a leadframe, a V-phase output node situated on a second leadframe island of said leadframe, and a W-phase output node situated on a W-phase die pad of said leadframe. The first leadframe island can be on a first leadframe strip of the leadframe, where the first leadframe strip is connected to a U-phase die pad of the leadframe. The second leadframe island can be on a second leadframe strip of the leadframe, where the second leadframe strip is connected to a V-phase die pad of the leadframe. A first W-phase power switch is situated on the W-phase die pad. Furthermore, at least one wirebond is connected to the W-phase die pad and to a source of a second W-phase power switch. The W-phase die pad can be a W-phase output terminal of the PQFN package. |
申请公布号 |
US9362215(B2) |
申请公布日期 |
2016.06.07 |
申请号 |
US201314102316 |
申请日期 |
2013.12.10 |
申请人 |
Infineon Technologies Americas Corp. |
发明人 |
Fernando Dean;Barbosa Roel |
分类号 |
H01L23/495;H01L23/31;H01L23/00 |
主分类号 |
H01L23/495 |
代理机构 |
Farjami & Farjami LLP |
代理人 |
Farjami & Farjami LLP |
主权项 |
1. A power quad flat no-lead (PQFN) package comprising:
a U-phase output node situated on a first leadframe island of a leadframe; a V-phase output node situated on a second leadframe island of said leadframe; a W-phase output node situated on a W-phase die pad of said leadframe; wherein said first leadframe island is on a corresponding first leadframe strip, said corresponding first leadframe strip being connected to a U-phase die pad. |
地址 |
El Segundo CA US |