发明名称 Power quad flat no-lead (PQFN) semiconductor package with leadframe islands for multi-phase power inverter
摘要 According to an exemplary implementation, a power quad flat no-lead (PQFN) package includes a U-phase output node situated on a first leadframe island of a leadframe, a V-phase output node situated on a second leadframe island of said leadframe, and a W-phase output node situated on a W-phase die pad of said leadframe. The first leadframe island can be on a first leadframe strip of the leadframe, where the first leadframe strip is connected to a U-phase die pad of the leadframe. The second leadframe island can be on a second leadframe strip of the leadframe, where the second leadframe strip is connected to a V-phase die pad of the leadframe. A first W-phase power switch is situated on the W-phase die pad. Furthermore, at least one wirebond is connected to the W-phase die pad and to a source of a second W-phase power switch. The W-phase die pad can be a W-phase output terminal of the PQFN package.
申请公布号 US9362215(B2) 申请公布日期 2016.06.07
申请号 US201314102316 申请日期 2013.12.10
申请人 Infineon Technologies Americas Corp. 发明人 Fernando Dean;Barbosa Roel
分类号 H01L23/495;H01L23/31;H01L23/00 主分类号 H01L23/495
代理机构 Farjami & Farjami LLP 代理人 Farjami & Farjami LLP
主权项 1. A power quad flat no-lead (PQFN) package comprising: a U-phase output node situated on a first leadframe island of a leadframe; a V-phase output node situated on a second leadframe island of said leadframe; a W-phase output node situated on a W-phase die pad of said leadframe; wherein said first leadframe island is on a corresponding first leadframe strip, said corresponding first leadframe strip being connected to a U-phase die pad.
地址 El Segundo CA US