| 发明名称 |
Hollow Metal Pillar Packaging Scheme |
| 摘要 |
An integrated circuit includes a bottom substrate, a metal layer disposed over the bottom substrate and a hollow metal pillar disposed on the metal layer. The metal layer and the hollow metal pillar are electrically connected. |
| 申请公布号 |
US2016225751(A1) |
申请公布日期 |
2016.08.04 |
| 申请号 |
US201615095765 |
申请日期 |
2016.04.11 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Huang Chang-Pin;Tu Hsien-Ming;Chen Hsien-Wei;Shao Tung-Liang;Yang Ching-Jung;Lai Yu-Chia |
| 分类号 |
H01L25/00;H01L25/065;H01L21/56;H01L23/00 |
主分类号 |
H01L25/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method, comprising:
forming a metal layer over a bottom substrate; and forming a hollow metal pillar on the metal layer, wherein the metal layer and the hollow metal pillar are electrically connected. |
| 地址 |
Hsin-Chu TW |
