| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition that forms an insulating layer having a high glass transition point and having excellent circuit embedding properties, and an adhesive film, a prepreg, a printed wiring board, and a semiconductor device prepared therewith.SOLUTION: A resin composition comprises (A) epoxy resin, (B) maleimide-containing silyl protective phenol, (C) inorganic filler and (D) thermoplastic resin.SELECTED DRAWING: None |
