| 摘要 |
The present invention relates to an LED lamp manufacturing method using a gold-plated thermal conductivity chip. The LED lamp manufacturing method using a gold-plated thermal conductivity chip comprises: a first step of forming a via hole (240) between a lower copper foil (230) and an LED device thermal terminal connection copper foil (222) of an upper copper foil (220) in a PCB assembly (50), in which a thermal terminal (19) of each LED device mounted in the upper copper foil (220) of the PCB assembly (50) in an LED lamp contacts the LED device thermal terminal connection copper foil (222): a second step of forming a copper film (250) on a bore of the via hole (240) through copper (Cu) plating; and a third step of inserting a gold-plated thermal conductivity chip (300) coated with a gold (Au) film into a silver (Ag) core in the copper film (250). The gold-plated thermal conductivity chip (300) is inserted between the upper copper foil (220) and the lower copper foil (230) of the PCB assembly (50) and is used as a heat transfer means, thereby rapidly dissipating high heat generated in the LED device. |
