| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can be made compact without sacrificing the bump connection area required for capturing conductive particles even in the bump layout of narrow pitch and arrow space and can prevent the occurrence of poor short circuit at the time of ACF connection, and to provide a display. <P>SOLUTION: A recess or a slit-like wedge type groove 2 or a stepped groove tapered from the inside of an IC toward the contour edge side thereof is formed in each bump 1 in a bump array A arranged at least on the contour edge side of the IC out of a plurality of staggering bump arrays wherein the width of the groove at the distal end is set smaller than the diameter of conductive particles contained in anisotropic conductive adhesive. When that IC is mounted using anisotropic conductive adhesive, the conductive particles can be captured in the space formed by the wedge type groove 2 or the stepped groove. Consequently, poor conduction or deterioration in reliability due to decrease in connection area is prevented and the occurrence of poor short circuit between bumps can be prevented. <P>COPYRIGHT: (C)2008,JPO&INPIT |
