发明名称 |
CURVED GROOVE PROCESSING OF POLISHING PAD |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for forming groove patterns on a CMP polishing pad using a CNC machining device and a lathe using a rotary bit capable of manufacturing the grooved CMP polishing pad more while keeping allowable quality more efficiently and at higher manufacturing rate. <P>SOLUTION: This method for forming grooves on a polishing pad 14 is effective for flattening a substrate in a chemical machine flattening process. In this method, grooves can be formed using a rotary bit by keeping average speed according to a bit diameter. Therefore, the grooves can be formed at higher speed while maintaining quality of the groove and reducing defects. <P>COPYRIGHT: (C)2008,JPO&INPIT |
申请公布号 |
JP2008137148(A) |
申请公布日期 |
2008.06.19 |
申请号 |
JP20070277365 |
申请日期 |
2007.10.25 |
申请人 |
ROHM & HAAS ELECTRONIC MATERIALS CMP HOLDINGS INC |
发明人 |
NAUGLER STEVEN;PUFKA STEVEN J;STACK JEFFREY R;WANG WEITUNG |
分类号 |
B23C3/34;B23C5/28;B24B37/00;H01L21/304 |
主分类号 |
B23C3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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