发明名称 CURVED GROOVE PROCESSING OF POLISHING PAD
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for forming groove patterns on a CMP polishing pad using a CNC machining device and a lathe using a rotary bit capable of manufacturing the grooved CMP polishing pad more while keeping allowable quality more efficiently and at higher manufacturing rate. <P>SOLUTION: This method for forming grooves on a polishing pad 14 is effective for flattening a substrate in a chemical machine flattening process. In this method, grooves can be formed using a rotary bit by keeping average speed according to a bit diameter. Therefore, the grooves can be formed at higher speed while maintaining quality of the groove and reducing defects. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008137148(A) 申请公布日期 2008.06.19
申请号 JP20070277365 申请日期 2007.10.25
申请人 ROHM & HAAS ELECTRONIC MATERIALS CMP HOLDINGS INC 发明人 NAUGLER STEVEN;PUFKA STEVEN J;STACK JEFFREY R;WANG WEITUNG
分类号 B23C3/34;B23C5/28;B24B37/00;H01L21/304 主分类号 B23C3/34
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