Methods for bonding substrates using liquid adhesive

摘要

Structures in an electronic device such as substrates associated with a display may be bonded together using liquid adhesive. Fiber-based equipment may be used to apply ultraviolet light to peripheral edges of an adhesive layer during bonding. There-dimensional adhesive shapes may be produced using nozzles with adjustable openings, computer-controlled positioners, and other adhesive dispensing equipment. Ultraviolet light may be applied to liquid adhesive through a mask with an opacity gradient. Adjustable shutter structures may control adhesive exposure to ultraviolet light. Ultraviolet light exposure may be used to create an adhesive dam that helps create a well defined adhesive border. Multiple layers of adhesive may be applied between a pair of substrates.

主权项

1. A method for bonding substrates, comprising:
applying liquid adhesive to at least one of the substrates; applying ultraviolet light to an edge of the liquid adhesive using fiber-based equipment, wherein the fiber-based equipment includes a fiber bundle containing a strip of fibers, wherein applying the ultraviolet light comprises applying the ultraviolet light using the strip of fibers, wherein each fiber in the fiber bundle emits light, and wherein a light modulator is interposed within the path of each fiber; and with a controller, sending control signals to the light modulator associated with each fiber to individually adjust a magnitude of light emitted by each fiber.