发明名称 |
Diode having a reduced surface field effect trench structure and method of manufacturing a diode having a reduced surface field effect trench structure |
摘要 |
A diode comprising a reduced surface field effect trench structure, the reduced surface field effect trench structure comprising at least two trenches formed in a substrate and separated from one another by a joining region of the substrate, the joining region comprising an electrical contact and a layer of p-doped semiconductor material. |
申请公布号 |
US9461183(B2) |
申请公布日期 |
2016.10.04 |
申请号 |
US201414499654 |
申请日期 |
2014.09.29 |
申请人 |
NXP B.V. |
发明人 |
Boettcher Tim;Fischer Jan |
分类号 |
H01L29/15;H01L31/0312;H01L29/872;H01L29/165;H01L21/283;H01L29/66;H01L29/861;H01L29/161;H01L29/40;H01L29/45;H01L29/47 |
主分类号 |
H01L29/15 |
代理机构 |
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代理人 |
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主权项 |
1. A diode comprising a reduced surface field effect trench structure, the reduced surface field effect trench structure comprising at least two trenches formed in a substrate and separated from one another by a joining region of the substrate, the joining region comprising an electrical contact and a layer of p-doped silicon germanium with a monocrystalline structure, wherein the at least two trenches are covered by a layer of p-doped silicon germanium with a polycrystalline structure, wherein the substrate comprises monocrystalline silicon and each trench comprises polycrystalline silicon separated from the monocrystalline silicon by a layer of silicon oxide, wherein the silicon oxide extends above upper surfaces of the monocrystalline silicon and the polycrystalline silicon, and wherein the silicon oxide has a top end with an angled top surface that extends above an upper surface of the layer of p-doped silicon germanium with the monocrystalline structure and extends below an upper surface of the layer of p-doped silicon germanium with the polycrystalline structure. |
地址 |
Eindhoven NL |