发明名称 Diode having a reduced surface field effect trench structure and method of manufacturing a diode having a reduced surface field effect trench structure
摘要 A diode comprising a reduced surface field effect trench structure, the reduced surface field effect trench structure comprising at least two trenches formed in a substrate and separated from one another by a joining region of the substrate, the joining region comprising an electrical contact and a layer of p-doped semiconductor material.
申请公布号 US9461183(B2) 申请公布日期 2016.10.04
申请号 US201414499654 申请日期 2014.09.29
申请人 NXP B.V. 发明人 Boettcher Tim;Fischer Jan
分类号 H01L29/15;H01L31/0312;H01L29/872;H01L29/165;H01L21/283;H01L29/66;H01L29/861;H01L29/161;H01L29/40;H01L29/45;H01L29/47 主分类号 H01L29/15
代理机构 代理人
主权项 1. A diode comprising a reduced surface field effect trench structure, the reduced surface field effect trench structure comprising at least two trenches formed in a substrate and separated from one another by a joining region of the substrate, the joining region comprising an electrical contact and a layer of p-doped silicon germanium with a monocrystalline structure, wherein the at least two trenches are covered by a layer of p-doped silicon germanium with a polycrystalline structure, wherein the substrate comprises monocrystalline silicon and each trench comprises polycrystalline silicon separated from the monocrystalline silicon by a layer of silicon oxide, wherein the silicon oxide extends above upper surfaces of the monocrystalline silicon and the polycrystalline silicon, and wherein the silicon oxide has a top end with an angled top surface that extends above an upper surface of the layer of p-doped silicon germanium with the monocrystalline structure and extends below an upper surface of the layer of p-doped silicon germanium with the polycrystalline structure.
地址 Eindhoven NL