| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor testing jig and a method of testing a semiconductor device, capable of evaluating electrical characteristics of an individualized semiconductor device, by using a vacuum chuck and a transportation system used for wafer evaluation.SOLUTION: A semiconductor testing jig according to the present invention comprises: a plate-like base formed with a plurality of base through holes; a frame part formed with a plurality of frame part through holes larger than the base through holes, and overlapped with an upper surface of the base; and a position adjustment part that defines positions of the base and the frame part so as to connect between the frame part through holes and the base through holes. The frame part is detachably attached with the base, and has a circular outline in a plan view.SELECTED DRAWING: Figure 2 |
