摘要 |
PURPOSE:To make it easier to perform mounting work for radiating light in parallel with the pattern wiring surface of a printed circuit board. CONSTITUTION:Wiring electrode parts 22 and 23 are formed on a package 21 by MID process, a linkage recessed part 27 is formed on a bottom surface 26 of the package 21, and this is fitted to the end part of a printed circuit board 11 and then soldered. |