发明名称 Hall sensor mounting in an implantable blood pump
摘要 A molded interconnect device can carry a Hall sensor for transducing a position of a rotor of the implantable blood pump. The molded interconnect device includes one or more integrated electronic circuit traces configured to electrically connect the hall sensor with a printed circuit board of the implantable blood pump, and the molded interconnect device is configured to be mounted to the printed circuit board.
申请公布号 US9492599(B2) 申请公布日期 2016.11.15
申请号 US201314015542 申请日期 2013.08.30
申请人 THORATEC CORPORATION 发明人 Schimpf Samuel;McChrystal Mark;Stark, III Joseph C.;Siebenhaar Andre
分类号 A61M1/10;A61M1/12;G01B7/00;H05K1/02;H05K3/30;F04D13/06;G01B7/30;H05K1/11;H05K1/18;F04D15/00;H05K3/46 主分类号 A61M1/10
代理机构 Kilpatrick Townsend & Stockton LLP 代理人 Kilpatrick Townsend & Stockton LLP
主权项 1. A device for transducing a position of a rotor of an implantable blood pump, the device comprising: a molded interconnect device comprising one or more integrated electronic circuit traces, wherein the molded interconnect device is to be mounted to a printed circuit board; and a Hall sensor coupled to the molded interconnect device for transducing the position of the rotor, wherein the one or more integrated electronic circuit traces are configured to electrically connect the Hall sensor with the printed circuit board of the implantable blood pump.
地址 Pleasanton CA US