| 摘要 |
Provided is a dicing tape with which it is possible to minimize chip scattering and chipping during a dicing step, with which pickup can easily be performed, and with which adhesive residues are unlikely to remain even for small and thin electronic components. The present invention provides a dicing tape obtained by layering an adhesive layer comprising an adhesive composition on a substrate film, wherein the dicing tape is characterized in that: the adhesive composition contains 100 parts by mass of a (meth)acrylic acid ester copolymer, 5-250 parts by mass of a photopolymerizing compound, 0.1-20 mass parts of a curing agent, and 0.1-20 mass parts of a photopolymerizing initiator, the (meth)acrylic acid ester copolymer containing 35-85% by mass of a methyl (meth)acrylate unit, 10-60% by mass of a 2-ethylhexyl (meth)acrylate unit, 0.5-10% by mass of a monomer unit having a carboxyl group, and 0.05-5% by mass of a monomer unit having a hydroxyl group, the photopolymerizing compound being a urethane acrylate oligomer having a weight-average molecular weight of 4,000-8,000 and 10-15 unsaturated double-bond functional groups, and the thickness of the adhesive layer being 3-7 μm. |
